Die packaging from Mintech
 
Mintech Interconnect and Test offer electronic component packaging services for industrial, commercial, military and space markets.
With many years experience of specialist die handling, traditional Chip on Board, ceramic and metal can packaging technology, Mintech also offer leading edge technologies such as Flip Chip on Board, WLCSP and stacked die solutions based on die gold stud bumping technology.With design, manufacture and test housed in the same UK based facility, Mintech are well placed to service the European marketplace.
A small military, space and industrial standard product range is available. Mintech also offer sub contract packaging services to a diverse range of customers from small start up companies, through fabless semiconductor companies to major military sub contractors.
If the exact product you need to satisfy your requirements is not available from the major silicon manufacturers then Mintech will employ their expertise, offering higher density solutions but also re-packaging to change footprint, improve functionality or enhance reliability.
Mintech's engineering team has extensive experience of handling all die and packaging technologies. They are capable to offer innovative 'out of the box' solutions to any electronic component packaging issue. The technical design team owns a wide range of expertise including Wafer fab, PCB technology and Thick Film Hybrid.
Go to Mintech web site for technical info,
or contact Brelco for more information.